Weightless Mobility - Designed for Lighter
and Slimmer Mobile Personal Electronics Systems
Whether for your briefcase or schoolbag, the VIA C3-M
processor is designed to reduce the weight and thickness
of mobile systems because to VIA, mobility means "easy
The VIA C3-M processor is based on VIA's highly efficient
CoolStream architecture, enabling it to run exceptionally
cool and making it possible to use low profile, smaller
and lighter cooling mechanisms that result in lighter,
slimmer notebook system designs.
The VIA C3-M comes in an Enhanced Ball Grid Array (EBGA)
package that spreads the thermal energy of the processor
over the full surface area of the processor, allowing
for even lighter, lower profile processor coolers. The
EBGA package helps to further reduce the thickness of
VIA C3-M systems because it measures a mere 1.525mm in
height and is mounted directly onto the mainboard, unlike
other processors that require a raised socket to hold
them in place.
Mobile device batteries are among the heaviest and bulkiest
components in the whole system. VIA CoolStream architecture
reduces power consumption, allowing VIA C3-M systems to
run with fewer or smaller and lighter batteries.